Enhancing Heat Transfer in Heat Pipes through Controlled Vibration

Cooling electronic chips and hardware is essential to their safe and reliable operation. Heat pipes are devices that transfer heat between a source and a sink through a phase change process. In this project, the performance of the state-of-the-art heat pipe designs is enhanced through artificially created body force fields that are controlled by vibration and/or centrifugal rotation.

Objective/Contribution:

The aim is to improve the heat transfer characteristics of the heat pipes to improve their capabilities to cool down processors and computer components, reducing their size and carbon footprint.