Study of Deformations and failure of materials using digital image processing ANd correlation

Abstract 

Digital image correlation (DIC) is a non-contact optical technique used to measure displacement and strain of materials under loading. It utilizes a speckle pattern on the specimen to track deformation and calculate strain, offering a cost-effective alternative to strain gauges. Both 2D and 3D DIC setups are employed for deformation measurement, crack detection, and crack density calculation. Digital image processing (DIP) is another non-contact method for identifying and measuring component behavior, such as displacement or strain. Studies on camera and image acquisition parameters are conducted to enhance image quality and accuracy. DIC and DIP provide valuable data for component testing and enable accurate measurements of material properties, including interlaminar fracture toughness. However, they are limited to analyzing deformation on visible surfaces and cannot assess deep-inside damage.

Partners

Cairo University